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| STTH8006 Turbo 2 ultrafast high voltage rectifier Main product characteristics IF(AV) VRRM Tj VF (typ) trr (max) 80 A 600 V 175 C 1.02 V 70 ns K A Features and benefits DO-247 STTH8006W Ultrafast switching Low reverse current Low thermal resistance Reduces switching and conduction losses Description The STTH8006, which is using ST Turbo 2 600V technology, is specially suited for use in switching power supplies, and industrial applications, as rectification and discontinuous mode PFC boost diode. Thanks to its low VF characteristics, this device exhibits high performances in freewheeling applications. Table 1. Symbol VRRM IF(RMS) IF(AV) IFSM Tstg Tj Order Code Part number STTH8006W Marking STTH8006W Absolute ratings (limiting values, at Tamb = 25 C, unless otherwise specified) Parameter Repetitive peak reverse voltage RMS forward voltage Average forward current Surge non repetitive forward current Storage temperature range Maximum operating junction temperature Tc = 75 C = 0.5 Value 600 113 80 500 -65 to + 175 175 Unit V A A A C C tp = 10 ms sinusoidal December 2006 Rev 1 www.st.com 1/6 6 Characteristics STTH8006 1 Table 2. Symbol Rth(j-c) Characteristics Thermal resistance Parameter Junction to case Value (max). 0.75 Unit C/W Table 3. Symbol IR(1) VF(2) Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 150 C Forward voltage drop Tj = 25 C Tj = 150 C VR = VRRM Min. Typ Max. 50 A 160 1600 1.60 IF = 80 A V 1.02 1.30 Unit 1. Pulse test: tp = 5 ms, < 2 % 2. Pulse test: tp = 380 s, < 2 % To evaluate the conduction losses use the following equation: P = 0.98 x IF(AV) + 0.004 IF2(RMS) Table 4. Symbol trr IRM tfr VFP Dynamic characterstics Parameter Reverse recovery time Reverse recovery current Forward recovery time Forward recovery voltage Tj = 25C Tj = 125C Tj = 25C Tj = 25C Test conditions IF = 0.5 A Irr = 0.25 A IR =1 A IF = 1 A dIF/dt = 50 A/s VR =30 V VR = 400 V IF = 80 A dIF/dt = 100 A/s IF = 80 A dIF/dt = 200 A/s VFR = 1.1 x VFmax IF = 80 A dIF/dt = 200 A/s VFR = 1.1 x VFmax 3.7 75 14 Min. Typ Max. 70 ns 105 19 600 A ns V Unit Figure 1. P(W) 140 Conduction losses versus average forward current =0.5 =1 Figure 2. IFM(A) 200 180 Forward voltage drop versus forward current 120 100 =0.05 =0.1 =0.2 160 140 120 100 Tj=150C (Maximum values) 80 60 40 20 Tj=150C (Typical values) Tj=25C (Maximum values) 80 60 T 40 IF(AV)(A) 0 0 10 20 30 40 50 60 70 =tp/T 80 90 tp 20 0 100 VFM(V) 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 0.00 2/6 STTH8006 Characteristics Figure 3. Relative variation of thermal impedance junction to case versus pulse duration Figure 4. Peak reverse recovery current versus dIF/dt (typical values) 1.0 0.9 0.8 0.7 0.6 0.5 Zth(j-c)/Rth(j-c) Single pulse IRM(A) 55 50 45 40 35 30 25 IF=80A VR=400V Tj=125C 0.4 0.3 0.2 0.1 0.0 1.E-03 1.E-02 1.E-01 1.E+00 20 15 10 tp(s) 5 0 0 50 100 150 dIF/dt(A/s) 200 250 300 350 400 450 500 Figure 5. trr(ns) Reverse recovery time versus dIF/dt Figure 6. (typical values) 3.0 IF = 80A VR=400V Tj=125C Reverse recovery charges versus dIF/dt (typical values) 800 700 600 500 400 300 200 100 Qrr(C) IF = 80A VR=400V Tj=125C 2.5 2.0 1.5 1.0 0.5 dIF/dt(A/s) 0 0 50 100 150 200 250 300 350 400 450 500 dIF/dt(A/s) 0.0 0 100 200 300 400 500 Figure 7. Relative variations of dynamic parameters versus junction temperature IF=80A VR=400V Reference: Tj=125C Figure 8. Transient peak forward voltage versus dIF/dt (typical values) 1.4 1.2 1.0 0.8 QRR VFP(V) 8 7 6 5 4 3 IRM IF=80A Tj=125C 0.6 0.4 0.2 tRR 2 Tj(C) 0.0 25 50 75 100 125 1 0 0 50 100 150 dIF/dt(A/s) 200 250 300 350 400 450 500 3/6 Package information STTH8006 Figure 9. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25C 100 VR(V) 10 1 10 100 1000 2 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 Nm. Maximum torque value: 1.0 Nm. DO-247 dimensions DIMENSIONS REF V Table 5. Millimeters Min Typ Max Min Inches Typ Max 0.203 0.102 0.031 0.055 0.078 0.094 0.429 0.620 0.793 0.169 0.728 0.582 1.362 0.216 0.118 5 60 0.143 V Dia. H A L5 L L2 L4 F2 L3 F3 V2 F G M E L1 D A 4.85 5.15 0.191 D 2.20 2.60 0.086 E 0.40 0.80 0.015 F 1.00 1.40 0.039 F2 2.00 F3 2.00 2.40 0.078 G 10.90 H 15.45 15.75 0.608 L 19.85 20.15 0.781 L1 3.70 4.30 0.145 L2 18.50 L3 14.20 14.80 0.559 L4 34.60 L5 5.50 M 2.00 3.00 0.078 V 5 V2 60 Dia. 3.55 3.65 0.139 4/6 STTH8006 Ordering information In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 3 Ordering information Part number STTH8006W Marking STTH8006W Package DO-247 Weight 4.40 g Base qty 30 Delivery mode Tube 4 Revision history Date 15-Dec-2006 Revision 1 Initial release. Changes 5/6 STTH8006 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 6/6 |
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